SK Hynix seems to have pulled off some of the specifications for the next generation of high bandwidth memory or HBM3. Still in development, it will soon be ready to join HPC servers as well as high-end high-end graphics cards. And, according to the specification, it looks like the new memory interface could give a big boost compared to the current memory standard.
The maximum pin transfer rate for HBM3 appears to increase from the current standard of 3.2 Gbps of HBM2 and HBM2E to a fast 5.2 Gbps. This sterling I / O speed would mean a 44% increase in transfer rates, and that means great stuff for serious graphics enthusiasts, probably more so than gamers.
This also means that previous rumors about the entry of HBM3 with a bandwidth of about 512 GB / s are a bit off. According to SK Hynix, we are now studying 665 GB / s, and it is likely that all this is backed by a massive maximum capacity of 64 GB, 2.6 times more than the 24 GB of HBM2E, and that it matches the capacity of the alternative GDDR6X.
It is true that these figures are likely to make GPU miners salivate more than gamers, Ethereum loves its bandwidth, as evidenced by the a new Nvidia monster mining card was rumored.
It is not known whether heat dissipation has improved further, or anything else in this regard; just a chart with some ballpark numbers. But we’ve all been thrilled by the next batch of professional graphics cards. We may see an increase in usage and increased demand that reduces the price of HBM3 to where it is a viable alternative to GDD6 for gaming GPUs as well, but that's probably just a pleasure.
Of course, these changes may change as SK Hynix advances the final stages of development, but current performance trends look good.